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上海本社
大途电子(上海)有限公司

TEL (021)-6093-2193

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半导体材料设备

Digital Flatness Tester 平坦度测量仪

FT-900, FT-17

Non-contact flatness (BOW / WARP / SORI) measurement machine.
Laser interference method.
Equipped with fringe analyzer.
非接触式的平坦度测量仪(BOW/WARP/SORI),采用激光干涉原理

Wafer Edge Grinder 倒角机



This machine is designed for grinding wafer edge with high precision.
倒角机用于对硅片边缘进行倒角的设备
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Double Side Lapping & Polishing Machine 双面研磨机和抛光机


This machine is designed for precision double side lapping wafers with slurry.
利用研磨液对硅片进行双面高精度研磨加工的设备
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不同型号的设备均可通过选项 ,配备研磨液循环系统、厚度控制仪、修整系统、数字式压力控制系统和安全自锁系统

Wafer Sorting Equipment 硅片分选机



Belt / Sequential

Robot / Batch
Non-contact/Non-destructive sensors非接触式,无破坏性
Dimension sensors : Thickness, Diameter, Edge/Notch dimensions, Flatness, Warp, etc.
Electrical/Image sensors : Resistivity, P/N, Edge chipping, Makyo, etc.
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Cassette to Cassette Single Wafer Polishing Machine 晶片篮至晶片篮 单面抛光机



MCP-300 / 200

MCP-150
This machine is designed to polish single side of wafers one by one accurately and efficiently.
逐片对硅片进行精确有效地单面抛光的设备
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Wafer Surface Measurement Machine 硅片表面测量仪



Nanometro-330F

Non-contact & contact surface measurement machine.
Laser measurement head & mechanical measurement head measures the wafer surface shape.
利用非接触或接触式方法,对硅片表面进行检测的设备
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Epitaxial Wafer Life-Time Measurement Machine 外延片寿命测量仪



LTA-1000EP

LTA-1200EP
This machine is for measuring the Life-time of wafer bulk, Epitaxial layer and SOI Layer.
用于测量批量硅片、外延片、SOI硅片寿命的设备
LTA-1200EP measure ~φ12” wafer automatically.
LEA-1000EP measure ~φ8” wafer automatically.
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Wafer Cleaner 硅片清洗机



Single wafer cleaning machine before inspection, measurement, test.
对外观检查前的硅片进行单片清洗的设备
Wafer Jet Cleaner : DJC-150
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